LED Heat Sink
Our heat sink material has many advantages over Al heat sink in terms of weight reduction, heat transfer, manufacturability and cost. Our approach is a hybrid design of metal (as insert during molding) and moldable polymer composite. Table 1 lists some of the characteristic of our materials and table 2 provides comparision of our approach and some current technologies.
| Properties | Our composite |
|---|---|
| HDT | 210C |
| Thermal Conductivity (in-plane) | 3.6 W/m.C |
| Surface Resistivity | 1013 Ohm/m2 |
| Breakdown Voltage | 4kV/mm |
| Flame Retardant | UL94 V0@1.3mm |
| GWIT | 960C@1.3mm |
| CTE | 2.39*10-5 1mm/C |
| Al Die-Casting | Thermally Conductive Plastics |
Our Composite | |
|---|---|---|---|
| Process Temperature, °C | 700-750 | 260-280 | 150-180 |
| Cycle Time | Med | Short | Med |
| Mode Life Cycle | Short | Long | Long |
| Machine | Complex | Simple | Simple |
| 2nd Operation | Yes | No | No |
| Carbon Emission | High | Med | Low |
Our composite materials, together with our unique part design technique under an injection molding process, could basically meet the following requirements:
- Thermally stable for LED light characteristics less than 110 C, the junction temperature of LED chip (or Temperature at LED Aluminum substrate less than 85C.
- The thermal resistance of heat components, Rth around 1 K/W or below.
- Dielectric voltage breakdown voltage for the heat is about 4000V/mm or slightly higher.
- Capable of high volume manufacturing by traditional thermal set injection molding process.
- Excellent design flexibility with 20+% lightweight reduction compared to similar Al heat sink products.
Our product has lower cost in comparision with our competitors.
A high power heat sink with a power input 20 W and 30% weigh reduction compared to Al heat sink was also successfully developed recently as is shown below.
| LED Power Input，W | 20 |
| Heat Sink type | PAR38（Proto type) |
| Height, cm | 74 |
| Number of Fins | 24 |
| Diameter, cm | 12 |
| External surface area, cm2 | 827.3 |
| Temp of LED chip, °C | 119.2 |
| Temp of Al Substrate, °C | 85.1 |
| Temp of External surface area, °C | 66.2 |
| Ambient temp, °C | 25 |
| Thermal Resistance of heat sink, °C/W | 0.9 |
Please contact us for a product and price quote.